KSW Microtec AG, uno de los principales proveedores mundiales de componentes e inlays RFID para tarjetas seguras, estará presente en la exposición Label Expo Europe 2009 en Bruselas, que tendrá lugar del 23 al 26 de septiembre.
La compañía mostrará soluciones RFID para múltiples aplicaciones en sectores que van desde el control de acceso, gestión de activos, ePayment, eTicketing y soluciones gubernamentales. En particular, KSW Microtec hará hincapié en sus últimas innovaciones como los inlays para parabrisas, lo que facilita el control de acceso en automóviles.
Nota de prensa completa en inglés
KSW Microtec AG – RFID innovation and quality at Label Expo Europe 2009
Dresden, Germany, September 7, 2009 – KSW Microtec AG, one of the world’s leading suppliers of RFID components and inlays for secure cards, documents and other form factors will be exhibiting at Label Expo Europe 2009 in Brussels, from September 23 to 26. The company will show RFID solutions for multiple applications in sectors ranging from secure access control, asset management, ePayment, eTicketing and government ID at their booth V103 in Hall 12.
In particular, KSW Microtec will highlight its sector specific innovations such as the Windspeed® family of windshield inlays. The windshield inlays provide accurate, efficient and secure vehicle access into a variety of locations and premises.
With Windspeed® users can achieve optimum levels of vehicle security – whether their requirement is safer parking, managed access control or both. This applies to fleet managers for commercial operations as well as private vehicle owners and operators. The inlays have a read range of 18 feet and, as they use passive RFID technology, there are significant economies of scale to be gained, compared to active windshield inlay options. The KSW Windshield Labels do not need additional layers, as they are self-adhesive.
Also on show will be the KSW Microtec Thinlam® inlay, with a thickness down to 280µm, for high security HF and UHF RFID card manufacturing. Visitors to Labelexpo will be able to view this product with various chips, for example NXP Microcontroller or Infineon NRG. Thinlam® and Dual Interface Thinlam® are both setting new standards for card manufacturing. This innovation enables manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate more security and other high value features into cards, but without compromising the durability and effectiveness of the card.
Thinlam® are very robust because of the unique patented chip connection technology. In addition, the KSW Thinlam® achieves low tolerances of the resonance frequency. Thinlam® can be manufactured on PVC, Polycarbonate, PET or Teslin® and can also be used for transparent RFID cards due to its excellent optical characteristics.
Other sectors, e.g. government applications, ePayment and identification in general, are fast growing markets for KSW Microtec’s pre-laminate products. These include ultra-thin polycarbonate inlays, which are meeting new demands set by these more secure card applications.
Senior KSW Microtec executives will be at the show and look forward to meeting customers and partners to personally discuss their current needs and help plan solutions for forthcoming projects.
Visit KSW Microtec at LabelExpo 2009, at Brussels Expo, on booth: V103 in Hall 12.